Co-located with the ReMAP AGM, ICEET will be joined by leaders in electronics technologies from industry, research, and academia to hear from keynote speakers, and see state-of-the-art innovations in electronics manufacturing.

ICEET 2019

Join ReMAP at the International Conference for Electronics Enabling Technologies (ICEET), formerly the International Conference on Soldering & Reliability (ICSR) from June 4-6th.

ReMAP will be joined by leaders in electronics technologies from industry, research, and academia to hear from keynote speakers, and see state-of-the-art innovations in electronics manufacturing.

This year ICEET is co-located with the ReMAP AGM on June 4th where you can get a sneak peak of the ICEET exhhibitors. Please note: pre-registration is required for the ReMAP AGM.  

ReMAP has the following recognized leaders in electronics participating at ICEET:

Irene Sterian, P. Eng., ReMAP President and CEO

  • ICEET Technical Committee

Jason Keeping, P. Eng., Corporate Advanced Process Development, Celestica Inc.

  • ICEET Technical Committee: Conference Chair
  • Session 8 Moderator: Ruggedization- The Next Technology Wave

Andre Delhaise, Metallurgist, Celestica Inc.

  • ICEET Technical Committee
  • Evaluation of Tin Whisker Formation of Discrete Capacitor Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage

Alex Chen, M.Eng, Technology Development Engineer, Celestica Inc.

  • Smart Textile Applications in Medical Devices & Senior Care

Nicolas Burgwin, P.Eng, Co-founder, Fibos Inc.

  • Optical Sensors: A Fundamental Shift in Collecting Data in Harsh Environments

Hamid Alemohammad,  PhD, Co-founder, CEO, AOMS Technologies Inc.

  • Industrial IoT Solutions with Fiber Optic Sensors

Matt Kelly, P.Eng, MBA, IBM Corporation

  • ICEET Technical Committee

About ICEET
The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high-density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

Find out about, ICEET 2018.

About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Date: June 4-6, 2019

Venue: ventureLAB

Address:  3600 Steeles Ave E, Markham, ON L3R 9Z7